Tech News: TSMC CoWoS in Short Supply, Apple and Qualcomm Explore Intel Advanced Packaging
- Posted on November 19, 2025
- By Google News
- 3 Views
Tech News: TSMC CoWoS in Short Supply, Apple and Qualcomm Explore Intel Advanced Packaging
According to recent industry reports, the demand for TSMC’s advanced CoWoS packaging capacity has surged dramatically. Despite TSMC’s ongoing efforts to expand production, capacity constraints continue to pose a key bottleneck for HPC and AI chip manufacturing.
